REEL to REEL Ag spot plating device
Compact design with FL +1000mm! Partial plating is also possible with drum plating.
Our company offers the 'REEL to REEL Ag Spot Plating Equipment' with automatic control using a touch panel and sequencer. By adopting an image processing system, we can reproduce plating area accuracy of ±0.07mm without pilot pins. Additionally, stable power supply and transport can be ensured with special power supply rollers and guide rollers. 【Equipment Overview】 ■ Number of Rows: 2 to 3 rows ■ Line Speed: Standard 3.6 to 4.0m/min ■ Target Products: Lead Frame, LED Frame, and others ■ Basic Plating Specifications: Cu + Ni + Ag Spot ■ Target Materials: 42 Alloy, Cu Alloy *For more details, please download the PDF or feel free to contact us.
- 企業：三友セミコンエンジニアリング
- 価格：Other
